Electronic and Electronic Assemblies

Today's electronic components are smaller and more complex, creating situations where dendritic growth or corrosion can proliferate if the cleaning is not perfect. With the now-pervasive deployment of BGA chips, MCM devices and even denser semiconductor packages, clearances are so tight that aqueous systems simply cannot clean these components without more pressure, more cleaning agents and more drying cycles.

The MicroCare specialty fluids rise to the challenge. They target the removal of ionics and the organics, including lead-free fluxes. MicroCare fluids get under tight-fitting components and remove corrosive fluxes before they can cause problems.

These fluids also remove fingerprint oils, uncured solder paste, some conformal coatings, marking inks and other contaminates.


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